MOTEK 2009 – International trade fair for assembly and handling technology
With more than 30,000 trade visitors from 61 nations and 1002 (MOTEK) plus 87 (BONDexpo) exhibitors from 21 countries the 28th MOTEK could exceed the expectations of the international suppliers and users by far.
Strama-MPS participated in this fair for the first time and was pleasantly surprised by the very good customer frequency. The main theme of the attractively designed stand was to show standardized solutions for tomorrow’s manufacturing technology. The interested visitors could get extensive information on the novelty ProMoChange® (linear motor change system for workpiece carriers) and assure themselves of the advantages of this system for more efficiency in assembly technology. Additionally, the compact laser marking cell ProMoScript® Basic for smaller quantities was presented in action. Who was interested could have marked wheat bear glasses and ballpoint pens with his name. This was very well received by the visitors.
Beside the known customers we could also welcome a number of potential customers at the stand. The expertise and decision-making competence of the visitors allowed intensive expert discussions and new interesting contacts could be made and a successful follow-up business after the fair can be expected.
Almost 1,100 exhibitors from 21 countries presented in Stuttgart from 21-24 September 2009 the worldwide offer including components, assemblies, subsystems and complete solutions for the automation in production and assembly as well as bonding-, encapsulation, sealing and foaming technology. The exhibitors reported strong and above all specific interest and finally were more than happy with the visitor numbers and the prospect of an interesting follow-up business after the fair.
The 31,284 trade visitors from 61 nations show that the MOTEK and BONDexpo play a significant role as the world’s most important industry and business meeting for mechatronic automation, robotics, industrial handling, material flow in production and assembly as well as bonding and joining technologies.
